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Tsev > Xov xwmNtsiab lus

Daim Ntawv Thov ntawm Ni - Pt Alloy Sputtering Target In Semiconductor Manufacturing

Tam sim no, lub ntsiab ntawm kev npaj nickel-platinum silicide zaj duab xis yog ua ntej daim iav implantation txheej hauv thaj av silicon ntawm lub semiconductor substrate, thiab mam li npaj ib txheej ntawm silicon epitaxial txheej rau nws, ua raws li ntawm sputtering rau ntawm qhov chaw ntawm lub silicon epitaxial txheej los ntawm magnetron sputtering Ib txheej ntawm NiPt zaj duab xis, thiab thaum kawg los ntawm txoj kev txheej txheem rau kev tsim nickel platinum silicide zaj duab xis.

Nickel Platinum Silicide Films nyob rau hauv Semiconductor Manufacturing Applications:

1. Daim ntawv thov nyob rau hauv Schottky Diode Manufacturing: Cov Phom Lawm Cov Phom Siav Ib hom siv ntawm cov xim nickel-platinum silicide films hauv cov khoom siv hluav taws xob Schottky. Nrog txoj kev loj hlob ntawm Schottky diode technology, hlau silicide - silicon kev sib txuas tau hloov cov tsoos hlau - silicon tiv tauj, kom tsis txhob muaj qhov teeb meem nto thiab paug, txo qhov feem ntawm lub xeev nto, txhim kho cov yam ntxwv zoo ntawm lub tshuab, rov qab muaj zog, qhov kub siab, kev tiv thaiv zoo li qub, kev ua kom tsis muaj zog. Nickel-platinum silicide yog qhov zoo tagnrho Schottky barrier hu rau cov khoom, ntawm qhov ib txhais tes nickel-platinum alloy ua teeb meem hlau, nrog kev ruaj siab kub zoo; qhov tod tes, Cov Phom Tshaj Tawm Tsiaj Qom los ntawm kev sib txoos sib txauv hloov mus ua kom tiav qhov siab qhov siab. Cov txheej txheem yog npaj los ntawm sputtering nickel-platinum alloy txheej ntawm N-hom silicon semiconductor substrate los ntawm magnetron sputtering, thiab kev nqus cov nqus tsev yog kwv yees li ntawm 460 ~ 480 ℃ rau 30 min los tsim cov kab mob NiPtSi-Si. Feem ntau yuav tsum tau tawg nthe NiV, TiW thiab lwm yam thaiv teeb meem, thaiv qhov cuam tshuam ntawm kev sib tsuam hlau interdiffusion, txhim kho tus ntaus ntawv txoj kev ua kom qis zog.

2. Cov ntawv thov nyob rau hauv semiconductor integrated circuits: Nickel-platinum silicides yog siv dav hauv VLSI microelectronic nyob rau hauv qhov chaw, ntws, rooj vag thiab hlau electrode kev sib cuag. Tam sim no, Ni-5% Pt (mole fraction) tau ua tiav rau 65nm tshuab, Ni-10% Pt (mole feem) siv 45nm tshuab. Nrog ntxiv txo qhov linewidth ntawm lub semiconductor ntaus ntawv, nws yog ua tau los ntxiv txhim kho Pt cov ntsiab lus nyob rau hauv lub npuas nickel-platinum los npaj lub NiPtSi hu zaj duab xis. Cov Phom Suab Txiag Tsiv Lub ntsiab yog vim li cas qhov nce ntawm Pt cov ntsiab lus hauv cov hlau yuav ua kom muaj kev ruaj siab kub ntawm qhov yeeb yaj kiab thiab txhim kho qhov sib txawv ntawm qhov zoo sib xws, txo qhov kev cuam tshuam ntawm kev ua yuam kev. Lub thickness ntawm nickel-platinum alloy zaj duab xis txheej ntawm qhov sib xyaw silicon ntaus ntawv feem ntau tsuas yog hais txog 10 nm, thiab txoj kev siv los tsim cov nickel-platinum tua neeg yog ib los yog ntau cov kauj ruam. Qhov kub yog nyob rau thaj tsam ntawm 400 txog 600 ° C rau 30 mus rau 60 s Cov

Nyob rau hauv xyoo tas los no, cov neeg tshawb xyuas thiaj li yuav txo tau qhov kev tiv thaiv overall ntawm cov nickel-platinum silicide, IBM tus patented ob-ruam manufacturing NiPtSi nyias zaj duab xis: thawj kauj ruam ntawm lub deposition ntawm siab Pt ntsiab lus ntawm nickel platinum alloy zaj duab xis deposition, Alloy Sputtering Target qhov thib ob theem ntawm cov ntsiab lus Pt Cov nickel-platinum alloy zaj duab xis tsis txawm muaj Pt ntshiab nikel zaj duab xis. Tus tsim ntawm nickel-platinum silicide zaj duab xis ntawm lub ntsiab lus ntawm Pt cov ntsiab lus, pab txo kom tsis txhob muaj tag nrho cov tsis kam ntawm nickel-platinum silicide, yog li nyob rau hauv lub tshuab tshiab, nws tseem tau siv ntau Pt ntsiab lus ntawm nickel-platinum alloy sputtering Lub phiaj nickel platinum silicide hu zaj duab xis nrog lub gradient qauv tau npaj.